Xaar hosts leading technology businesses at manufacturing flexibility workshop

GrantrManufacturing, Member News, Members

Xaar hosted members of the NMI including Diodes, Ultra CEMS, SPTS Technologies and Newport Wafer Fab at its workshop on ‘Learning and Development for Manufacturing Flexibility’ at Xaar’s Huntingdon site on 18th June. The interactive session highlighted the importance of focusing on people in the overall process, with discussion groups working to define key learning points for the implementation of … Read More

Moortec announce their Embedded In-Chip Monitoring Subsystem on TSMC 7FF

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Moortec Semiconductor, specialists in embedded in-chip sensing, are pleased to announce the availability of their easy to integrate, embedded monitoring subsystem on TSMC’s 7nm FinFET (FF) process. Within the subsystem the new 7nm Temperature Sensor is a high precision low power junction temperature sensor that has been developed to be embedded into ASIC designs. It can be used for a … Read More

Sundance announces the SMT6657

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Sundance announces the SMT6657 – the highest performance PC/104 embedded processing module ever – Chosen for the SIS100 Proton Accelerator at the new Facility for Antiproton and Ion Research in Europe (FAIR) Digital processing provided by on-board TI Keystone® DSP Versatility, pre/post processing and I/O provided by on-board Xilinx Kintex® Ultrascale™ KU35 FPGA Chesham, UK – 19th July 2017. Sundance … Read More

enModus Lands £3m in Series A Funding

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Smart building technology company enModus raises £3m from three investors including shopping centre giant intu   Total funding to date amounts to £9m – £6m in seed investment since launch in 2010   Ambition to grow customer base worldwide with ground-breaking powerline communications technology   Chepstow, 11 July 2017 – enModus, a smart building technology company from Wales, has secured … Read More

EnSilica and sureCore announce the development of IoT platform

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By David Manners, ElectronicsWeekly.com. Read the original article here. NMI would like to congratulate with its two members EnSilica and sureCore for the development of an ultra-low power IoT reference platform for wearable consumer and medical applicaitons.    The IoT reference platform has been taped out using TSMC’s commercially available 40nm Ultra Low Power (40ULP) process technology. TSMC’s 40nm process … Read More

Sondrel Agrees to Acquire IMGworks Division of Imagination Technologies

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Sondrel announced today that it has signed an agreement to acquire the IMGworks division of Imagination Technologies. As part of this deal the IMGworks engineering team will join with Sondrel’s existing engineering consultancy to create a combined IC design capability comprising more than 250 highly skilled employees. IMGworks provides System on Chip design and software integration services, allowing its fabless … Read More

Moortec and UltraSoc collaborate to enable next-generation “smart” PVT sensors

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UltraSoC and Moortec Semiconductor today announced that they are cooperating on system-on-chip (SoC) monitoring and analytics intellectual property (IP) to enable a new generation of Process, Voltage and Temperature (PVT) sensor sub-systems. By integrating UltraSoC’s digital monitoring and optimization capabilities, with Moortec’s industry-leading PVT products this enables powerful, chip-wide infrastructure to improve SoC performance and reliability. Moortec’s PVT sensor sub-systems … Read More

Feabhas announces the UK’s first Agile for Embedded Conference

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This new conference offers a pragmatic and practical approach to using Agile in the embedded development environment. Feabhas, the UK’s leading independent provider of embedded software development training and ARM Approved Training Centre, announces it is holding the UK’s first Agile for Embedded Conference on 3 May at Easthampstead Park, Berkshire. The conference is aimed at senior engineers and managers … Read More