We support customers from initial prototype assembly to full run-rate production. Our state of the art, automated assembly equipment can support millions of die per year and includes plastic encapsuled QFN packages.
Packaging takes place in our Scotland based ISO class 7 clean room, supported by an ISO9001 and EN9100 certified quality management system.
With our group of companies in Spain, France and Germany we can offer end to end turnkey backend semiconductor manufacturing, from wafer test to assembled and tested product. Full device qualification can be offered following automotive or space standards, including testing for lifetime/endurance, environmental, mechanical shock/vibration and radiation.