Promoted Event

On June 26-28, 2023, in Dresden, Germany, the SEMI 3D & Systems Summit will gather industry experts and visionaries will share their insights into 3D and Heterogeneous Integration Roadmap (HIR) processes for semiconductor manufacturing and applications.

This Conference and Exhibition will present the best of microelectronics packaging and interconnection technologies, providing world-class coverage of technological innovation in the microelectronics and packaging field with contributions from both industry and academia.