All Day

Semi: Smarter Systems Through Heterogeneous Integration

Dresden

On June 26-28, 2023, in Dresden, Germany, the SEMI 3D & Systems Summit will gather industry experts and visionaries will share their insights into 3D and Heterogeneous Integration Roadmap (HIR) processes for semiconductor manufacturing and applications.

Unwrapping the Patent Box for Automation & Technologies businesses

Webinar

TechWorks members new to Patent Box will benefit from a practical overview of how it works and the benefits it delivers, while those already familiar with the regime can find out more about the synergies between Patent Box, R&D tax relief and other innovation incentives.