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PROMOTED EVENT: RELPACK 2017 – Reliability Engineering for Electronic Packaging

30th November 2017
STFC – Daresbury Laboratory, Sci-Tech
Daresbury, WA4 4AD

This conference aims to bring together an array of electronics packaging experts and reliability service providers to present a comprehensive review of the spectrum of reliability engineering, including modelling to predict lifetimes, design for reliability, importance of hermeticity, failure analysis methods, ruggedisation of standard electronic products, highly accelerated life testing and reliability testing for wearables and the Internet of Things.

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