Semi: Smarter Systems Through Heterogeneous Integration

On June 26-28, 2023, in Dresden, Germany, the SEMI 3D & Systems Summit will gather industry experts and visionaries will share their insights into 3D and Heterogeneous Integration Roadmap (HIR) processes for semiconductor manufacturing and applications.

Join our distinguished speakers!
Themed Smarter Systems through Heterogeneous Integration, the summit will feature speakers from industry leaders and representatives from new and innovative companies.

With:
– Raja Swaminathan, Corporate VP, AMD
– Rozalia Beica, VP Strategic Marketing & Business Development, Microelectronics Business Unit, AT&S China
– Luc Augustin, CTO, SMART Photonics
– Emilie Jolivet, Semiconductor, Memory and Computing Division Director, Yole Group
– Pascal Metzger, CEO, SET Corporation
– E. Jan Vardaman, President, TechSearch International, Inc.
– Yoan Dupret, Managing Director and CTO, Menta SAS
– Seung Kang, VP of Strategy, Adeia
– Isabella Drolz, VP Product Marketing, Comet Yxlon
– Andre Blum, Project Manager, Progressive Semiconductor Program, AUDI AG

Check the agenda for the full list of speakers: https://www.semi.org/eu/connect/events/3d-and-systems-summit#agenda

Learn more & Secure your ticket today!
https://www.semi.org/eu/connect/events/3d-and-systems-summit