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IMAPS-UK: EMPC23 – The 24th European Microelectronics & Packaging Conference
Geonome Centre HinxtonThis Conference and Exhibition will present the best of microelectronics packaging and interconnection technologies, providing world-class coverage of technological innovation in the microelectronics and packaging field with contributions from both industry and academia.
Semi: Smarter Systems Through Heterogeneous Integration
DresdenOn June 26-28, 2023, in Dresden, Germany, the SEMI 3D & Systems Summit will gather industry experts and visionaries will share their insights into 3D and Heterogeneous Integration Roadmap (HIR) processes for semiconductor manufacturing and applications.
NMI PARTNERED EVENT: Cambridge Wireless International Conference
Wellcome Genome Campus Conference Centre Wellcome Genome Campus, HinxtonThe overall aim of the conference is to set new paths for the industry by debating controversial technology and business issues.