Latest Past Events

IMAPS-UK: EMPC23 – The 24th European Microelectronics & Packaging Conference

Geonome Centre Hinxton

This Conference and Exhibition will present the best of microelectronics packaging and interconnection technologies, providing world-class coverage of technological innovation in the microelectronics and packaging field with contributions from both industry and academia.

Semi: Smarter Systems Through Heterogeneous Integration

Dresden

On June 26-28, 2023, in Dresden, Germany, the SEMI 3D & Systems Summit will gather industry experts and visionaries will share their insights into 3D and Heterogeneous Integration Roadmap (HIR) processes for semiconductor manufacturing and applications.