Design Advisory Board
The Microelectronics Design Advisory Board (MDAB) oversees the development and implementation of strategy for the IC design community. It functions as a source of insight, knowledge, expertise and ideas providing guidance and quality assurance for the initiatives of NMI.
Biographies of each of the directors can be accessed using the links below.
Geoff is responsible for leading a number of design process improvement projects within Broadcom and directing the development of Broadcom’s Firepath DSP processor. He graduated in 1984 from Oxford University and spent 5 years as a researcher in Oxford’s Programming Research Group. He joined ST Microelectronics in 1989 before joining start-up Element-14 in 1999. Element-14 was acquired by Broadcom in 2000.
Geoff is the author of 9 patents and 28 published papers. He has also made key contributions to programming language design (occam-3 and UBIK), microprocessor design and verification methodologies.
Since September 2015 Nick is VP Engineering at Qualcomm Technologies International Ltd. Previously, Nick was responsible for Platform Hardware Design within CSR, leading the analogue RF/IC design, physical design, EDA, and chip program management activities. He joined CSR in 2004 to set up a team producing ASSP variants of Bluetooth chips, taking responsibility for all CSR’s physical design, packaging and program management activities in 2006. In 2010, he became VP PMO, responsible for the program management of CSR’s chip products, developing and deploying a full Product Development Lifecycle process. Following CSR’s divestment of handset business to Samsung in 2012, Nick additionally became responsible for analog design and development.
Prior to 2004, Nick served as a design engineer at Inmos, designing graphics chips, and then spent 11 years at ARM in roles including digital design, project management, and ultimately running a back-end implementation services group. He has a degree in Electronic Engineering from the University of Westminster, is a Chartered Engineer and a member of the IET and IEEE. He is also a member of the UKESF Strategic Advisory Board.
Andy is the Senior Engineering Director responsible for Advanced Technology for Dialog Semiconductor, developing leading edge performance IP, new product areas and pushing into new processes. He has teams in the UK, Germany and Japan. Andy joined Dialog Semiconductor in September 1991 in analogue design, progressed to leading chip designs and took over the Advanced Technology Group in 2007. Prior to that he was a founder member of the Analogue Design team at MEDL Lincoln. He has a degree in Electronics from the University of Southampton, a couple of patents and a racing dinghy.
Ian is CEO of INEX Microtechnology Ltd, a unique nano-fabrication facility and manufacturer of “Things” such as specialist sensors and exotic semiconductors, recently spun out of the University of Newcastle. It is positioning itself to be a key player in ubiquitous sensing markets and performance systems supply chains.
Previously Ian was CEO, CTO and co-founder of eoSemi, a startup focusing on the replacement of quartz with CMOS for electronic timing references. Prior to starting eoSemi, Ian was co-founder and Chief Technical Officer of Anadigm, a leading supplier of programmable analog ICs and software spun out of Motorola/Pilkington Micro-electronics, where he jointly developed the first commercial dynamically field-programmable analog array (FPAA).
A 1985 BSc Hons graduate of the University of Edinburgh, Ian started professional life at Philips Research, is author of 17 technical publications – two winning institutional awards, and 8 patents on analog IC and systems design. He has a keen interest in technology enterprise and is a long-term member of the IEEE. For fun he flies microlights.
Prior to this he was the Senior Director and General Manager of NXP Semiconductors Digital TV SoC Group having joined the company in 1991. He led NXP’s Digital IC division, which utilises many of the companies latest design flows methodologies and research activities, from an emerging consumer perspective to complete products in Set Top Box and Digital TV.
Before NXP, Sharif held the title for Development Manager of the STB Group. In this position, he led the organization that researches, develops and designs next-generation hardware and software technologies for all Set Top Box platforms for consumer market segments.
Previously, Sharif led a number of program management roles, where he was responsible for NXP’s Digital TV chipsets and systems for consumer and commercial OEM customers.
Sharif received a bachelor’s degree in Electrical and Electronic engineering from Portsmouth University in 1991.
Dermot’s role involves setting the strategic direction for S3’s System-on-Chip (SoC) design services business and the Mixed Signal IP product portfolio. Dermot has full responsibility for global sales and operations and manages key strategic relationships, delivering successful solutions to clients such as NXP, TI, Micronas and Phonak amongst others.
Prior to joining S3 Dermot worked as Research & Development Engineer for Philips Research in Eindhoven from 1985-1994 where he was responsible for analogue IC design focusing on ICs for mobile, broadcast and cordless communications. From 1994-1997 Dermot was VP of US Sales & Business Development at S3 and drove S3’s initial ventures into the US marketplace from a base in San Jose.
Dermot joined Cadence Design Systems, from 1997-2000, as a Senior Sales Manager for Design Services in UK and Israel, again broadening his expertise and experience in the industry. Dermot re-joined S3 in 2000 as General Manager of the Wireless Systems Business Unit and was recently appointed as VP, Consumer Silicon.
Dermot is well known in the industry and is a key member of S3’s management team. Dermot graduated from University College Dublin in 1985 with a Bachelor of Engineering (B.Eng.).
In 1979 Roger graduated with a degree in mathematics from Warwick University and joined Inmos, a high-profile UK funded semiconductor start-up which was subsequently acquired by SGS-Thomson Microelectronics (now STMicroelectronics). At Inmos Roger worked on the Inmos transputer and the occam parallel programming language. Later he set up the organisation which delivered the software tools, operating system and applications for a 64-bit processor developed by ST and subsequently took the Lx/ST200 VLIW processor from a research project to a mass production product. In his final years at ST he worked on the development of low-power, high-performance ARM processors for mobile and data-centre.
In 2014 Roger left ST and set up Chipless Ltd, a company providing technical and commercial advice in the areas of microsystems architecture, parallel processing systems, and processor architecture, micro architecture and design.
Roger has been a Visiting Professor of Engineering in the Department of Computer Science at Sheffield University and was the recipient of an STMicroelectronics “Exceptional Patent Award” in 2000.
Dr Alison Burdett holds the position of CTO at Toumaz, Oxford UK. She obtained a BEng degree in Electrical and Electronic Engineering from Imperial College in 1989, and a PhD from the same institution in 1992. From 1992 to 1994, she worked as an Integrated Circuit Design Engineer for GEC-Plessey Semiconductors, on the design of low-voltage, low-power paging receivers. In 1994, she joined the Department of Electrical and Electronic Engineering, Imperial College London, as Senior Lecturer in Analogue Circuit Design. In 2001, she left Imperial College to co-found Toumaz, where she is responsible for delivering the silicon technology roadmap, particularly in the area of ultra-low power wireless technologies for medical applications, and networked consumer connectivity. Dr. Burdett is a Chartered Engineer, a Fellow of the Institute of Engineering and Technology (FIET) and a Senior Member of IEEE. She has published over 75 refereed technical publications and holds 15 patents. She is an Associate Editor of IEEE Transactions on Biomedical Circuits and Systems (TBCAS) and a member of the Technical Programme Committee for the IEEE International Solid State Circuits Conference (ISSCC). She is also a Visiting Researcher at the Institute of Biomedical Engineering, Imperial College.
Holger is Director of Engineering at Cirrus Logic. Prior, he was leading Wolfson’s Platform Development team whose areas of responsibility include Digital and Mixed-Signal IP, Technology Development, CAD and Methodologies. After graduating from Fachhochschule Konstanz (Germany) in 1994 with a degree in Communications Engineering, Holger joined Dialog Semiconductor as Mixed Signal Design Engineer where he was involved in designing the company’s first ever power management product. He went on to work for austriamicrosystems in Graz (Austria) before joining Wolfson’s newly established design centre in Swindon in 2004 as Principal Design Engineer. Before taking up his current role Holger has also held the roles of Principal Technologist, Power Management IP Director and Technical Director.
Paul is Design Centre manager at Infineon Technologies Bristol and R+D Director for IFX (UK) Ltd; he joined the company back in 1999. Prior to that, Paul worked as Development Manager at Nortel and as Senior Design Engineer at Plessey Semiconductors. He graduated in Electrical and Electronic Engineering at Coventry University in 1989. Today Paul has over 25+ years of successful experience in product development and project-program management within a range of semiconductor/product/system organisations. Specifically related to applications in DSP, Image processing, Automotive, Cryptographic, Microcontroller and Microprocessor areas developing ASIC/FPGA/PCB and SOC products. Moreover, he gained experience in managing large multi-national global project teams; involving teams in the US, Europe and the Far East; 3rd party sub-contractor management and significant experience in Rapid Development.