The main motivation for introduction of this forum is based on the following:

  • IC Packaging is becoming a key enabler to the growing fabless community in particular
  • Package technology such as (SiP) can offer high density, high performance and low cost-per-function for microelectronics systems integration.
  • Allows the mixing of optimum active and passive device technologies in bare die format within a single package outline for cost effective, high performance, short time-to-market functionality well matched to a wide range of low, medium and high volume electronics product applications.
  • The addition of embedded passive component technology within such SiP modules also promises further performance, size, weight and cost benefits.
  • HETROGENOUS Integration is based on IC Packaging technology development.


  • Enable / facilitate collaboration, communication and knowledge transfer
  • Increase awareness externally of the network’s capabilities and opportunities
  • Signposting of UK capabilities, requirements and strengths.

Previous Events:

  • 2013, 6th June, “Cost effective thermal design”, IfM, Cambridge
  • 2012, 23rd May, “3D Packaging”, TWI, Granta Park, Cambridge
  • 2011 May 26th, TWI Cambridge,”Packaging Innovation: Choosing the right solution”
  • 2010 May 25th, Lifting the hood on product design, TWI , Granta Park, Cambridge
  • 2009 April 22, Astride the Packaging Roadmap, Cambridge
  • 2008 June, Design for SiP, Cambridge
  • 2007 June, System in Package, Cambridge
  • 2006 June, Wafer Level Packaging, Cambridge


The Presentation materials from previous events are available to all NMI members in the member area  of this website.