Spray nozzle upgrade for Polyimide developer systems
— INNOSPRAY —

• Fully integrated system
• Available for SÜSS and soon for TEL and DNS developers
• Main Features
  • Fixed spray angle and defined drop size
  • Easy mechanical adjustment of the nozzle
  • Electromagnetic vaporization
  • Minimal misting and overspray
  • Monitoring and flow detection with alarm possible
• Cost reduction
  • Spray solution is delivered to the target with minimal waste
  • Reduction of developer consumption (up to 50% depends on actual system)
  • Reduction of process time (depends on actual system)
  • Reduced Extraction needed
  • No N2 needed for Vaporization
  • Only 1 nozzle for 4/5/8 inch. 12 inch 1 or 2 nozzles

Resist Pump Upgrade
— INNOPUMP —

• fully integrated
• available for SÜSS coaters
• main features
  • compact pressure based dispense system used
  • dispense resists with low and high viscosities
  • high accuracy of +/-3%
  • no mechanical parts for pump needed.
  • low risk of bubbles
  • flow rate and dispense volume is controlled

Hotplate wafer tilt detection

• fully integrated
• available for SÜSS coaters and under development for others
• main features
  • detects foreign material on the hotplates
  • alarms if a wafer is not positioned correctly
• benefits
  • less rework
  • less scrap

Wafer edge detection

• fully integrated
• available for SÜSS coaters and under development for others
• main features
  • Vision Sensor mounted on EBR arm.
  • Wafer centering control before process
  • Wafer edge control after coating and wafer edge removal
• benefits
  • less rework
  • less scrap