IC Packaging Technical Network Event – “Astride the Packaging Roadmap”

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The National Microelectronics Institute (NMI) and TWI organisaed the fourth in a series of annual one-day seminars addressing microelectronics packaging trends, technologies and applications which was hosted at TWI, Granta Park, Great Abington, Cambridge. The 2009 seminar focused on the Microelectronics Packaging Roadmap and had been timed to coincide with the recent publication of the 2009 Global Packaging Roadmap by the International Electronics Manufacturing Initiative (iNEMI) who are headquartered in the USA.

Download presentations from this event (ZIP, 5mb)

Presentations included  :

  • Keynote – The iNEMI Roadmap 2009, Grace O’Malley, iNEMI 
  • A package fit for purpose, CSR
  • Packaging Technologies for Power Electronics, David Newcombe, Dynex Semiconductor
  • Thorsten Bucksch, RoodMicrotec
  • Package technology development for SiP, Alan Evans, Unisem
  • System-in-Package and Passive Integration – options and directions, David Pedder, TWI
  • Influence of Package Choice on your System Reliability, Nick Renaud-Bezot, Serma Technologies