IC Packaging Technical Network Event – Astride the Packaging Roadmap

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The National Microelectronics Institute (NMI) and TWI organised the fourth in a series of annual one-day seminars addressing microelectronics packaging trends, technologies and applications which was hosted at TWI, Granta Park, Great Abington, Cambridge. The 2009 seminar focused on the Microelectronics Packaging Roadmap and was timed to coincide with the recent publication of the 2009 Global Packaging Roadmap by the International Electronics Manufacturing Initiative (iNEMI) who are headquartered in the USA.

Keynote – The iNEMI Roadmap 2009, Grace O’Malley, iNEMI 
A package fit for purpose, CSR
Packaging Technologies for Power Electronics, David Newcombe, Dynex Semiconductor
Thorsten Bucksch, RoodMicrotec
Package technology development for SiP, Alan Evans, Unisem
System-in-Package and Passive Integration – options and directions, David Pedder, TWI
Influence of Package Choice on your System Reliability, Nick Renaud-Bezot, Serma Technologies