Embedded Innovation Network : Multi-Core/Multi-Processor Systems

GrantrMembers, Past Events

Multi-Core & Multi-Processor systems have been gaining ground for a number of years. Now with the complexity of such systems rapidly increasing, the ending of the ‘free lunch’ delivered by successive generations of silicon technology and the need for performance gains coupled with energy efficiency, what is the way forward?

IC Packaging Technical Network Event – “Astride the Packaging Roadmap”

GrantrMembers, Past Events

The National Microelectronics Institute (NMI) and TWI organisaed the fourth in a series of annual one-day seminars addressing microelectronics packaging trends, technologies and applications which was hosted at TWI, Granta Park, Great Abington, Cambridge. The 2009 seminar focused on the Microelectronics Packaging Roadmap and had been timed to coincide with the recent publication of the 2009 Global Packaging Roadmap by … Read More