Promoted Event
ISO 26262 Internal Auditor (Internal FSMS Auditor)
MIRA Technology Park Watling Street, Nuneaton, Warwickshire, United KingdomThis practical five-day course will provide you with the knowledge and skills you need to perform internal audits of functional safety management systems (FSMS).
NMI PARTNERED EVENT: CWIC Starter Event – Transport & Mobility
Runway East 10 Finsbury Square, London, EC2A 1AFIn the 60s and 70s public transport was the norm and owning a car was a sign of prestige; in the 80s and in the 90s car ownership was a rite of passage for everyone, and buses were [...]
NMI PARTNERED EVENT: CWIC Starter Event – LPWAN & IoT
Computer Laboratory University of Cambridge, 15 JJ Thomson Avenue, CambridgeLed by the Connected Devices SIG champions, who have decades of shared experience, augmented by other industry experts, this is aimed at anyone who wants to see what these future technologies could do for their business.
NMI PARTNERED EVENT: CWIC Starter – Healthcare
Clifford Albutt Lecture Theatre Addenbrookes Hospital, NHS Foundation Trust, Hills Road, CambridgeThis CWIC-starter event will be looking at the unmet needs of the healthcare sector starting from a bottom up approach to enable those who are new to the sector the ability to learn more about this complex market and to refresh those who are currently active in the sector.
NMI PARTNERED EVENT: Cambridge Wireless International Conference
Wellcome Genome Campus Conference Centre Wellcome Genome Campus, Hinxton, CambridgeshireThe overall aim of the conference is to set new paths for the industry by debating controversial technology and business issues.
Semi: Smarter Systems Through Heterogeneous Integration
Dresden , GermanyOn June 26-28, 2023, in Dresden, Germany, the SEMI 3D & Systems Summit will gather industry experts and visionaries will share their insights into 3D and Heterogeneous Integration Roadmap (HIR) processes for semiconductor manufacturing and applications.
IMAPS-UK: EMPC23 – The 24th European Microelectronics & Packaging Conference
Geonome Centre Hinxton, CambridgeshireThis Conference and Exhibition will present the best of microelectronics packaging and interconnection technologies, providing world-class coverage of technological innovation in the microelectronics and packaging field with contributions from both industry and academia.