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SUMMARY:Semi: Smarter Systems Through Heterogeneous Integration
DESCRIPTION:Semi: Smarter Systems Through Heterogeneous Integration\nRegisterOn June 26-28\, 2023\, in Dresden\, Germany\, the SEMI 3D & Systems Summit will gather industry experts and visionaries will share their insights into 3D and Heterogeneous Integration Roadmap (HIR) processes for semiconductor manufacturing and applications.\nJoin our distinguished speakers!\nThemed Smarter Systems through Heterogeneous Integration\, the summit will feature speakers from industry leaders and representatives from new and innovative companies. \nWith:\n– Raja Swaminathan\, Corporate VP\, AMD\n– Rozalia Beica\, VP Strategic Marketing & Business Development\, Microelectronics Business Unit\, AT&S China\n– Luc Augustin\, CTO\, SMART Photonics\n– Emilie Jolivet\, Semiconductor\, Memory and Computing Division Director\, Yole Group\n– Pascal Metzger\, CEO\, SET Corporation\n– E. Jan Vardaman\, President\, TechSearch International\, Inc.\n– Yoan Dupret\, Managing Director and CTO\, Menta SAS\n– Seung Kang\, VP of Strategy\, Adeia\n– Isabella Drolz\, VP Product Marketing\, Comet Yxlon\n– Andre Blum\, Project Manager\, Progressive Semiconductor Program\, AUDI AG \nCheck the agenda for the full list of speakers: https://www.semi.org/eu/connect/events/3d-and-systems-summit#agenda \nLearn more & Secure your ticket today!\nhttps://www.semi.org/eu/connect/events/3d-and-systems-summit
URL:https://nmi.org.uk/event/semi-smarter-systems-through-heterogeneous-integration/
LOCATION:Dresden\, Germany
CATEGORIES:Promoted Event
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