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PROMOTED EVENT: The Packaging Workshop – “The Event for Learning about Micro-Electronic Packaging”
28th September 2017 @ 9:00 am - 4:30 pm
This educational Workshop event organised by IMAPS-UK will deliver tutorials and case studies to provide an overview of some basic packaging techniques including die bond and wire bond, as well as a taster of some more advanced techniques. The Workshop, which is limited in numbers, is aimed at an audience consisting of chip related designers and those either wishing to learn more or those new to the microelectronics packaging industry.
“The Packaging Workshop” is supported by Airbus Defence and Space, Portsmouth and will include facility tours, plus a unique Packaging Surgery, where industry experts will advise on packaging issues raised by delegates attending the event.
For more information, please visit the Packaging Workshop website.