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This Semiconductor Packaging Workshop on Thursday 11 February 2021 brings together an array of electronics packaging experts and practitioners to present a comprehensive review of key Semiconductor Packaging technologies including Die Preparation, Attach and Interconnection techniques, Package, Substrate and Encapsulation options, Modelling and Simulation and Test, Inspection and Reliability.

The event provides training for staff who need to be aware of the benefits of employing basic packaging technologies for the design and manufacture of electronic products. It will also serve as a refresher for those who wish to expand the breadth of their knowledge and build their network of contacts in the field of electronic packaging.

“The Semiconductor Packaging Online Workshop” includes a Packaging Surgery, where industry experts will discuss any relevant packaging issues raised by delegates attending the event.


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