PROMOTED EVENT: RELPACK 2017 – Reliability Engineering for Electronic Packaging
The reliability of electronics is almost taken for granted, with a few notable exceptions, which hit the headlines around the world. Behind the scenes, extensive work is carried out to prove the reliability of electronic components/modules and demonstrate their fitness for purpose from consumer products through to safety critical applications in medical, automotive and aerospace.
Packaging and assembly processes are key elements governing both the manufacturing reliability and longevity of electronic products, but the science and engineering in determining reliability are often overlooked in satisfying minimum qualification requirements.
This conference aims to bring together an array of electronics packaging experts and reliability service providers to present a comprehensive review of the spectrum of reliability engineering, including modelling to predict lifetimes, design for reliability, importance of hermeticity, failure analysis methods, ruggedisation of standard electronic products, highly accelerated life testing and reliability testing for wearables and the Internet of Things.
For more information and to register, please visit the RELPACK 2017 website.