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Design for Manufacture Network: “Packaging in a Post Moore’s World”
10th September 2015 @ 8:30 am - 4:30 pmFree
Moore’s Law reaches its 50th anniversary in this year and with Finfet technologies and some advances in the wafer processing capabilities it looks set to continue for some years. However there is a growing recognition that the dynamic in the industry is changing and that Moore’s law is important to fewer and fewer players and no longer can you be assured that the next node will indeed be cheaper.
So some nodes such as 28nm and maybe 40nm have become the nodes where most people are likely to design their products for a significant time. In addition the industry will start to improve these nodes in ways that we have not seen in the past. There will be new processes, materials and devices developed for these nodes and advanced packaging solutions such as 2.5D and 3D advanced forms of WLCSP and SIP’s will become as important as process development.
Is now the time for packaging?
The industry has been waiting for advanced packaging to become an affordable reality for some years and some are sceptical that it ever will. However as Moore’s law no longer offers an affordable integration path, is it finally time that these advanced technologies can become mainstream?
What will be the packaging challenges in the coming few years can packing packaging compensate for the slowdown in Moore’s law and what will the challenges be, Thermal, Mechanical, Noise, interconnect density and what ways can these be solved for future devices and systems.
08:30 Registration & Coffee – Networking and Sponsor Tabletops
09:15 Welcome and Introduction – Patrick McNamee, NMI and Peter Collier, MTC
“More than Moore – Packaging is going 3D and is Embedding an Increasing Range of Functions Beyond Mere Digital Processing”
– Nick Pearne – BPA Consulting
“3D Printed Package Components for High Performance Packaging”
– Nad Karim – EoPlex
“More than Moore with 3D-on-3D”
– Giles Peckham – Xilinx
“DISCO solutions for thinning, dicing and packaging of thin devices (5 – 50 µm) made of Silicon, Sapphire and Compound materials like SiC and GaN”
– Gerald Klug – DISCO HI-TEC UK
“Printed and Additive Methods for Circuit Interconnects and Packaging”
– Neil Chilton – Printed Electronics
“Advanced Packaging for All!”
– Paul Double – HT Technology
“Advanced Packaging Center: Towards the Foundry Model in Packaging for the Semiconductor Industry”
– Eef Boschman – Advanced Packaging Centre
“Merging Wafer Fab, Packaging and PCB Technologies to Cost Effectively Address Packaging of Next Generation SOC Devices”
– Chris Scanlan – Deca Technologies
“Addressing and Managing Increasing Complexity for Electronic Systems – from Silicon (with a particular emphasis on mixed signal Socs), through Package and onto Printed Circuit Board”
– Heiko Dudek, Cadence
“Europe’s Approach to Advanced Packaging Technology Development”
– Andy Longford – PandA Europe
16:05 Event Close and Tour
Thank you to our Host and Sponsors:
The Manufacturing Technology Centre (MTC) will be hosting a tour of their facilities at the end of the day.
MTC develops and proves innovative manufacturing processes and technologies in an agile, low risk environment, in partnership with industry, academia and other institutions. They focus on delivering bespoke manufacturing system solutions for their customers. They operate in sectors as diverse as automotive, aerospace, rail, informatics, food & drink, construction/civil engineering, electronics, oil & gas and defence.
You must register to attend the tour prior to the event via the registration page.
This event is free for NMI Members.
Tickets for Non-Members are £150 +VAT
For sponsorship opportunities, please contact Patrick McNamee.