Thank you to our Event Partner and Sponsors:
This Unique Conference, organised by NMI and IMAPS-UK, being held within the Mitel Facility is your opportunity to Learn how embedded die technology can miniaturise, improve performance and reduce cost for applications such as power, wireless and wearables.
Electronic Systems increasingly lie at the heart of the infrastructure and applications we take for granted in everyday life. From mobile phones and tablets through to connected autonomous vehicles, Medical devices, renewable energy controllers and many more. Many of these applications require increased levels of integration and miniaturisation which has traditionally come from Die Shrink (Moores Law) and Package Integration (MCM, POP, etc). Embedded Die Technology (EDT) provides an opportunity for high levels of integration at competitive price as alternative to technology such as 2.5D TSV. EDT in particular offers considerable benefits such as high I/O density, multi-die, small footprint and flexible routing.
NMI in partnership with IMAPS-UK are delighted to announce this UK first Premier Conference on EDT Technology which will offer those involved with placement of die and components within the PCB and those involved with Die Package and Interconnection Technologies, an opportunity to learn about EDT Technology, Process Tools and Flows, Materials Selection / Options, Design – Industrialisation and Applications that are being enabled by EDT technology.
Don’t miss this opportunity to hear from and network with experts, share thinking with peers and meet our Exhibitors from the Packaging Supply Chain at the co-located exhibition.
09:30 Welcome and Introduction – NMI & IMAPS UK
09:45 Keynote – “Evolution and Future of Embedding Technology”
– Andreas Ostmann, Fraunhofer IZM
Session 1 – EDT Technologies
10:25 “Technology Options for 3D Heterogeneous Integration – Embedding”
– Nick Pearne, BPA Consulting
11:30 “Challenges for Embedded Device Technologies for Package Level Integration”
– Steve Riches, Tribus-D
11:55 “Modelling Embedded Die Technology Systems”
– Dr Stoyan Stoyanov, University of Greenwich
12:20 “Analysis, Test and Reliability of EDT Systems”
– Andrew Richardson, Lancaster University
12:45 Exhibitor Elevator Pitches
Session 2 – EDT Enabled Applications
14:05 “EDT for Power Devices”
– Cyril Buttay, INSA
14:30 “Ultra-thin Packaging Technology (UTCP) for Embedding in Flexible Substrates”
– Philip Ekkels, MbedICs – IMEC
Session 3 – Applications Enabled by EDT
15:35 “International Standards Affecting Embedding Technology”
– Chris Hunt, NPL
16:00 “Why Embedded Die?”
– Piers Tremlett, Microsemi
16:25 “Enhancing Power Modules Efficiency by Chip Embedding”
– Kay Essig, ASE Europe
16:50 Summary and Wrap Up Session
17:00 Event Close