Electronics content and complexity in Mission Critical Systems is growing and the challenges of understanding and managing Reliability get tougher. Our line up of speakers took us through Chip level , board level and finally System topics revealing the challenges and potential solutions in a variety of technologies.
DOWNLOAD PRESENTATIONS The forecasted increases in Chip Complexity and trends in Hetrogeneous Integrated Devices brings the challenge of managing Test Cost & Complexity high on the agenda. This event focused on the innovative techniques of “Design for Test” that are available to tackle this challenge, and showed through case study presentations how some are already being resolved and how others … Read More
With a particular focus on mobile/portable devices and digital / IP TV, this event presented embedded software case studies and projects showing how this is achieved and illustrating the drivers and trends behind this transition, such as features, performance, latency, security, safety and energy efficiency. Along the way we considered the challenges that the move to software-centric product design has brought and whether such an approach is always to the benefit of the user.
It’s well-recognised that electronics contributes a major portion of the automobile value and new and significant opportunities now exist within the automotive electronics supply chain. This event pulled together key suppliers from semiconductors through to major automotive manufacturers and provided a focal point for building greater understanding of automotive technology capability and market requirements.
NMI was delighted to introduce a combined IC Package / System-Level Design Network event on the theme “Lifting the Lid on Product Design“. This event provided a unique opportunity for delegates to learn about the challenges and enabling solutions being implemented from Chip to Package to Product in today’s highly complex technologies.
As Customer demands on Quality and Reliability become increasingly tough Companies must invest more by “designing in” ( DfR ) rather than trying to “screen out”. The event dealt with a broad cross section of “Quality and Reliability Assurance” issues faced by UK Semiconductor companies
An NMI Design for Manufacture Innovation Network Event looking at the theme of “Application Aware” in the context of Wireless communications and high reliability applications.
In a world of large digital devices containing key analogue functions, it is important that performance of the ‘small’ analogue is maintained and ‘digital assistance’ can be one way of achieving this.
This event considered the benefits and pitfalls of various approaches.