As Customer demands on Quality and Reliability become increasingly tough Companies must invest more by “designing in” ( DfR ) rather than trying to “screen out”. The event dealt with a broad cross section of “Quality and Reliability Assurance” issues faced by UK Semiconductor companies
An NMI Design for Manufacture Innovation Network Event looking at the theme of “Application Aware” in the context of Wireless communications and high reliability applications.
In a world of large digital devices containing key analogue functions, it is important that performance of the ‘small’ analogue is maintained and ‘digital assistance’ can be one way of achieving this.
This event considered the benefits and pitfalls of various approaches.
In 2006, the NMI System-Level Design Network addressed ESL through a “Design for Re-use and Legacy IP” event. Three years on, we reviewed what ESL means today with a variety of case studies and presentations.
NMI launched the Electronics enabling the Low Carbon Economy Innovation Network with a focus on priority applications areas where Semiconductor technology is a key enabler.
Multi-Core & Multi-Processor systems have been gaining ground for a number of years. Now with the complexity of such systems rapidly increasing, the ending of the ‘free lunch’ delivered by successive generations of silicon technology and the need for performance gains coupled with energy efficiency, what is the way forward?
Hosted at Savoy Place, London by The National Microelectronics Institute (NMI), in collaboration with the UK’s nanoCMOS Consortium, ICCV 2009 “Living with Variability” attracted expert speakers from around the world and an international audience representing chip designers, manufacturers and tool vendors.
The National Microelectronics Institute (NMI) and TWI organisaed the fourth in a series of annual one-day seminars addressing microelectronics packaging trends, technologies and applications which was hosted at TWI, Granta Park, Great Abington, Cambridge. The 2009 seminar focused on the Microelectronics Packaging Roadmap and had been timed to coincide with the recent publication of the 2009 Global Packaging Roadmap by … Read More