Fit for Manufacture: Using DfT to deliver on cost, quality and TTM

GrantrMembers, Past Events

To ensure a product meets the cost, quality and time constraints it is essential to choose the appropriate test strategy relative to the complexity of the device. Using case studies and expert contributors, this event examined the different strategies adopted by designers, test developers, test hardware and test service providers working in a variety of different market segments.

iPower 2011

GrantrMembers, Past Events

UK Microelectronics Packaging Society (IMAPS-UK) & NMI held a two day technical conference and industry networking event at the WMG, Warwick University, Coventry in conjunction with the University’s, Electronics, Power and Microsystems Research Group (PEATER).

Audio Everywhere

GrantrMembers, Past Events

Audio plays a key and increasing part in many products and systems. It can often be an important differentiator and the UK hasworld-class expertise in this area.
Using case studies and expert contributors this event will showcase audio design ingenuity encompassing both analogue/mixed-signal and digital processing as well as looking at audio applications with a particular focus on chip-level implementations

Energy Efficient Silicon Design

GrantrMembers, Past Events

Using case studies and expert contributors, this event looked at the latest design techniques that enable improved energy efficiency in the silicon while considering the ‘system’ drivers which also influence power consumption.

Multicore Processors – Embedded Software Network

GrantrMembers, Past Events

Multicore systems – homogeneous and heterogeneous – are now mainstream but are they delivering the promised gains? This event focused on software and how multicore systems are programmed to both obtain maximum use of resources while also ensuring reliability.

Chip Reliability for Mission Critical Systems

GrantrMembers, Past Events

Electronics content and complexity in Mission Critical Systems is growing and the challenges of understanding and managing Reliability get tougher. Our line up of speakers took us through Chip level , board level and finally System topics revealing the challenges and potential solutions in a variety of technologies.