IC Packaging Technical Network Event – “Astride the Packaging Roadmap”

GrantrMembers, Past Events

The National Microelectronics Institute (NMI) and TWI organisaed the fourth in a series of annual one-day seminars addressing microelectronics packaging trends, technologies and applications which was hosted at TWI, Granta Park, Great Abington, Cambridge. The 2009 seminar focused on the Microelectronics Packaging Roadmap and had been timed to coincide with the recent publication of the 2009 Global Packaging Roadmap by … Read More

High Speed Communications – Analogue/Mixed-Signal Network

GrantrMembers, Past Events

This event, part of the NMI Analogue/Mixed-Signal/RF Network, looked at the technologies behind a range of high speed wireline and wireless technologies and consider the challenges in meeting the demand for ever increasing data rates. We also looked at the evolution of telecommunications networks, the opportunities created by greater integration of infrastructure and an initiative to develop the next generation of communications engineers.